This study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2005 through 2010. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, and 3.5G technologies; by major semiconductor device type; and by geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard and component subsystem. Further detail is provided by component for each air interface. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast to the prior forecast is also noted.