This study examines Ethernet ASSPs/ASICs shipping into networking markets including NIC/LOMs (within desktops, notebooks, and servers) and LAN switch infrastructure (fixed and modular Layer 2, Layer 3, and Layer 4-7 switches). IDC also includes coverage of Ethernet semiconductors shipping within other system markets that offer this connectivity feature. Examples here include broadband customer premise equipment (CPE), WLAN access points, routers, IP phones, blade server switches, storage networking systems, and telecom equipment (DSL/PON aggregation and ATCA). A top-line forecast for application-specific semiconductor products is provided, segmented by key end market and by speed for 2006-2011.
Companies Mentioned: Agere; Broadcom; Marvell; LSI Logic; Intel; Texas Instrument; Keyeye; ClairPhy; Vitesse