INTRODUCTION

OBJECTIVES

This study focuses on plastic usage in the electronics industry. It is not a review of the entire electronics industry, but deals with development of resins and resin grades to meet requirements of electronic technologies related to computers, telecommunications, automotive, and other industries that employ electronic components.

SCOPE AND FORMAT

This study does not cover all electronic components, only those where plastics are used to a significant extent. In addition, fiber optics, wire and cable, enclosures and recording media are excluded. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.

In addition, the study describes key participants in the electronic components industry in terms of resin producers and molders, key technologies and the competitive resin scenario.

REASONS FOR DOING THE STUDY

Resin consumption in electronic components had been growing at rates well above the GDP for over a decade. The last quarter of 2000 saw a significant deceleration in sales of electronic products that continued through 2001 and has been exacerbated by the events of September 11^th. A new appraisal of this market is clearly needed during these uncertain times, especially since the overall economy is the midst of a serious downturn.

METHODOLOGY

A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets, and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.

ACRONYMS

In order to ease reading of this report, many acronyms are used throughout that mostly deal with resin names. The terms "plastic," "resin" and "polymer" are used interchangeably as are "unsaturated polyesters" and "thermoset polyesters," and "epoxies" and "epoxy resins." The term "alloy/blend" is most often used to denote either an alloy or a blend except in special cases where producers call their resins "alloys" or "blends." The following is an alphabetical list of acronyms used in the study:

• BGA - ball grid array
• BMC - bulk molding compound
• COB - chip-on-board
• DAP - diallyl phthalate
• DGA - die grid array
• DMT - dimethyl terephthalate
• E/E - electric/electronic industry
• EMI - electromagnetic interference
• ESD - electrostatic dissipation
• ETP - engineering thermoplastic (also engineering resin)
• FEP - fluoroethylenepropylene copolymer
• FR - flame retardant
• GDP - Gross Domestic Product
• HDT - heat deflection temperature
• HTN - high-temperature nylon
• Ics - integrated circuits
• LCP - liquid crystal polymer
• MCM - multichip module
• PAI - polyamide imide
• PBT - poly(butylene terephthalate)
• PC - polycarbonate
• PC - personal computer
• PCB - printed circuit board
• PCT - polycyclohexyl dimethylene terephthalate
• PEEK - polyetherether ketone
• PEI - polyetherimide
• PES - polyether sulfone
• PET - polyethylene terephthalate
• PPA - polyphthalamide
• PPS - poly(phenylene sulfide)
• PTFE - polytetrafluoroethylene
• PVC - polyvinyl chloride
• PWB - printed wire board
• RFI - radio frequency interference
• RIM - reaction injection molding
• SMC - sheet molding compound
• SMT - surface mount technology
• SPS - syndiotactic polystyrene
• TAB - tape automated bonding
• Tg - glass transition temperature
• TSPE - thermoset polyester
• UL - Underwriters Laboratory
• UTH - under-the-hood automotive market

INTRODUCTION

• OBJECTIVES
• SCOPE AND FORMAT
• REASONS FOR DOING THE STUDY
• METHODOLOGY
• ACRONYMS
• RELATED PUBLICATIONS
• BCC ONLINE SERVICE
  • INTERNET

SUMMARY

RESINS USED IN ELECTRONIC COMPONENTS

• THERMOPLASTICS
  • NYLONS
  • Background
  • Properties
  • Major Types
    • Nylon 66
    • Nylon 6
    • Similarities and Differences between Properties of Nylon 6 and Nylon 66
  • Other Nylons
    • Overview
    • Nylon 46
  • Reinforced Nylons
  • Processing
  • Electric/Electronic Applications
  • Producers and Capacities
  • New Developments
  • Market Estimates and Forecasts
  • THERMOPLASTIC POLYESTERS
  • Background
  • Polybutylene Terephthalate (PBT)
    • Background
    • Properties
    • Applications
    • Producers
    • New Developments
  • Polyethylene Terephthalate (PET)
    • Background
    • Properties and Grades
    • Applications
    • Producers
    • New Developments
    • PET and PBT Competitive Scenario
  • Polycyclohexyldimethylene Terephthalate (PCT)
    • Background
    • Properties
    • Producers and Applications
    • New Developments
  • Market Estimates and Forecasts
  • POLYPHENYLENE SULFIDES (PPS)
  • Background
  • Properties
  • Advantages and Disadvantages
  • Applications
  • Producers
  • Other Technology Considerations
  • Market Estimates and Forecasts
  • POLYIMIDES/PEI/PAI
  • Background
  • Properties
  • Vespel™ Parts
  • A Major Electric/Electronic Application - Dielectric Interlayers
  • Polyimide Films
  • Polyetherimides (PEIs)
    • Background
    • Properties
    • Applications
  • Polyamideimides (PAIs)
    • Background
    • Properties
    • Applications
    • Producers
  • New Developments
  • Market Estimates and Forecasts
  • POLYCARBONATES
  • Background
  • General Grades
  • Properties
  • Polyester Carbonates
  • Applications
  • Marketing
  • New Developments
  • Producers and Capacities
  • Market Estimates and Forecasts
  • POLYPHTHALAMIDES (PPA)
  • Background
  • Properties and Applications
  • Producers
  • Market Estimates and Forecasts
  • LIQUID CRYSTAL POLYMERS (LCPs)
  • Background
  • Properties
  • Applications
    • Background
    • Electrical/Electronics
    • Other
  • Producers
  • Market Estimates and Forecasts
  • POLYSULFONES
  • Background
  • Types of Polysulfones
    • Polyethersulfones (PES)
  • Polyarylsulfones
  • Grades
  • Properties
  • Electrical/Electronic Applications
  • Other Applications of Polysulfones
  • Producer Scenario
  • Market Estimates and Forecasts
  • ALLOYS/BLENDS
  • Polyphenylene Oxides/High Impact Polystyrene PPO/HIPS
    • Background
    • Properties
    • Applications
  • PEI/Polycarbonate Blends
  • Recent Alloy/Blend Developments
    • Compatibilizer Advances
    • LCP Teams Up With Polycarbonates and PET
    • LCP/PPS Alloys
  • Market Estimates and Forecasts
  • FLUOROPOLYMERS
  • Background
  • Properties and Applications
  • Producers
  • Market Estimates and Forecasts
  • POLYKETONES
  • Background
  • Properties
  • Applications
  • Marketing
  • Producers
  • Recent Developments
  • Market Estimates and Forecasts
  • SYNDIOTACTIC POLYSTYRENE (SPS)
  • Background
  • Properties and Grades
  • Applications
  • Advantages and Disadvantages
  • Recent Developments
  • Market Estimates and Forecasts
  • THERMOPLASTIC MARKET ESTIMATES AND FORECASTS SUMMARY
• THERMOSET RESINS
  • OVERVIEW
  • REINFORCED GRADES
  • GENERAL PROPERTIES
  • EPOXY RESINS
  • Background
  • Chemical Epoxy Types
  • Technology and Properties
  • Epoxy Systems
    • Background
    • Non-Molded Epoxies
    • Laminating Systems
    • Molded Epoxies
  • Producers
  • Formulators
  • Market Estimates and Forecasts
  • POLYURETHANES
  • Background
  • General Applications
  • Market Estimates and Forecasts
  • PHENOLICS
  • Background
  • Grades
  • Molding Compounds
  • Electric/Electronic Applications
  • Producers
  • Market Estimates and Forecasts
  • UNSATURATED POLYESTERS
  • Background
  • Ingredients of Unsaturated Polyester Formulations
  • Bulk Molding Compounds (BMC)
    • Background
    • Applications
  • Producers and Suppliers
  • Market Estimates and Forecasts
  • DIALLYL PHTHALATE (DAP)
  • Background and Applications
  • Producers
  • Market Estimates and Forecasts
  • THERMOSET MARKET ESTIMATE AND FORECAST SUMMARY

ELECTRONIC COMPONENT PRODUCTS

• INTRODUCTION
• ACTIVE DEVICES
• ACTIVE/PASSIVE DEVICES
• PASSIVE DEVICES
• FOCUS OF THIS REPORT
  • PRINTED CIRCUIT BOARDS (PCBs)
  • Background
  • Property Requirements
    • Electrical
    • Mechanical
    • Other
  • Issues Facing Plastics Usage
  • PCB Substrates
  • Rigid PCBs
    • Background
    • Current Material Usage
      • Standard FR-4 Epoxy Resin
      • Higher-Performance Epoxies
      • Polyimides
      • Cyanate Esters
      • Silicon-Carbon
      • PTFE
      • BT Resins
      • Phenolics
      • Melamine
      • Other Materials
        • Copper Foils
        • Glass Cloth
    • Types of Reinforcements
    • Needs of Microwave Circuits
    • Environmental Issues with PCB Laminates
    • Use of Other Flame Retardants
    • PCB Manufacturers
    • PCB Laminate Suppliers
  • Flexible Printed Circuit Boards
    • Background
    • Technology
    • Standards
    • Materials Used
    • Adhesiveless Laminates
  • Rigid-Flex Circuits
  • New PCB Technical Developments
    • Laminate Upgrades
    • PCBs Will Need To Meet Demand For Tighter Substrate Lines and Spaces
    • Treatments and Finishes for Green Technologies
    • Embedded Components
    • Flex Circuit Materials
  • New Products and Developments
    • Dupont in Thin Flex Alliance
    • 3M Starts New Flex Operation
    • PCB Makers Head South
    • Biodegradable PCBs
  • Market Estimates and Forecasts
  • INTERCONNECTS
  • Background
  • Definitions
  • Trends
  • Interconnect Packaging Evolution
    • Background
  • Methods of Interconnection
    • Background
    • DGA vs. BGA
    • High-Density Chips
      • Background
      • Technology
      • Materials Used
        • Background
        • Epoxy Alternatives
        • Current Alternatives with Polyimides
        • Potential Replacement for Conventional Interconnects
    • Multichip Modules (MCMs)
      • Background
      • Rationale for Use
      • Types of MCMs
      • Materials Used
      • Problems for MCMs
    • SMT Chip Carriers
    • Molded/3D PCBs
      • Background
      • Materials Used
      • Manufacturing of MIDs
      • Market Target
      • Process Technologies
  • MOLDED ELECTRONIC PRODUCTS
  • Background
  • Demand
  • Market Drivers
  • Connectors
    • Background
    • Trends
    • Function of Connectors
    • Resin Selection
    • Manufacturers
    • End-Use Markets
      • Background
      • Communications Industry
      • Automotive Industry
        • Background
        • Resin Scenario
      • Other Markets
    • Market Estimates and Forecasts
  • Switches
    • Background
    • Market Estimates and Forecasts
  • Bobbins
    • Background
    • Market Estimates and Forecasts
  • Relays
  • Capacitors
    • Background
    • Consumption by Market Segment
    • Market Estimates and Forecasts
  • Other Molded Electronic Components
    • Background
      • Resistors
      • Inductors/Transformers
    • New Developments That Will Affect Discrete Electronic Molded Parts
      • Background
      • Thin Is In
      • Combining Passive and Interconnect Devices with Ceramics
  • Market Estimates and Forecasts (Other Electronics)
  • Molded Electronic Component Summary
  • ENCAPSULANTS
  • Definitions and Background
  • Primary Purposes of Encapsulation
  • Organic Encapsulants
    • Background
    • Types and Application Modes
  • Epoxy Encapsulation Formulations
  • Encapsulated Electrical Components
    • Background
    • Specific Encapsulant Applications
  • Recent Developments
    • Advances in Thermoplastic Encapsulants
    • New Products from RTP
    • BayerЃs Polyurethanes
    • DexterЃs New Hysol™ Product
  • Specifications and Standards
    • Overview
    • UL 1694 Looks at Circuit Boards
  • Major Selected Encapsulant Producers and Their Product Lines
    • Oxychem Electronic Materials
    • Dexter
    • Loctite Corporation
    • Vantico
    • Lord Chemical
  • Market Estimates and Forecasts
  • SUMMARY MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC DEVICES
  • By Application
  • By Resin

APPLICATION BY END USE

• BACKGROUND
• COMPUTERS AND PERIPHERALS
  • BACKGROUND
  • DESKTOP COMPUTERS
  • MONITORS
  • KEYBOARDS
  • NOTEBOOKS
  • Background
  • Features of Newly Introduced Models
  • HAND-HELDS
  • Background
  • Other Hand-Held Computer Aspects
  • Power Considerations
  • PRINTERS
  • Background
  • Market Segments
  • SCANNERS
  • Background
  • FACSIMILE MACHINES (FAX MACHINES)
  • COPIERS
  • PHONES
  • Corded
  • Cordless
  • Cellular
  • PAGERS
• CONSUMER ELECTRONICS
  • OVERVIEW
  • BACKGROUND
  • TELEVISION SETS
  • CAMCORDERS
• AUTOMOTIVE UNDER-THE-HOOD
  • OVERVIEW
  • MATERIAL USAGE
  • EXPANDED USE OF ENCAPSULATED COMPONENTS
  • BOBBINS/CONNECTORS
  • SWITCHES/SOCKETS
  • IGNITION COMPONENTS
  • TRENDS AND DEVELOPMENTS
  • Polymer Fuses
  • Injection Molding Cells
• AEROSPACE/DEFENSE
  • OVERVIEW
  • FALLOUT FROM THE SEPTEMBER 11TH TRAGEDY
• APPLIANCES
• MEDICAL DEVICES
• MARKET ESTIMATES AND FORECASTS

EMI SHIELDING

• BACKGROUND
• OVERVIEW
• SHIELDING EFFECTIVENESS
• COST AND PERFORMANCE CHARACTERISTICS OF SHIELDING OPTIONS
• ELECTRONIC INDUSTRY/EMI SHIELDING INTERFACE
  • BACKGROUND
  • COMPUTERS AND EMI
  • CELLULAR PHONES
  • TV RECEIVERS
  • VCRs
  • STEREO COMPONENTS
  • NEW DEVELOPMENTS WITH STEEL FIBERS
  • CONDUCTIVE PLASTICS
  • Background
  • Advantages/Disadvantages
  • Compounding
  • INHERENTLY CONDUCTIVE POLYMERS (ICPS)
  • Background
  • Polymer Types
  • Base Resins
  • Versicon™
  • Recent Developments
    • Ormecron-Dupont-Philips Get Together
    • Owens CorningЃs Shielding System
    • Bayer Moves Into the Picture
    • LNP Develops Thermally Conductive Thermoplastics
    • BF Goodrich Stat-Rite™ Grades
    • Eastman Chemical Launches ESD Products
  • CONDUCTIVE COATINGS
  • Background
  • Solvent-Based vs. Water-Borne Conductive Coatings
• REGULATORY ISSUES RELATED TO EMI
  • BACKGROUND
  • PART 15
  • CLASS A AND CLASS B EQUIPMENT
• IMPACT OF MINIATURIZATION ON EMI SHIELDING

TECHNOLOGY TRENDS RELATED TO ELECTRONIC COMPONENTS

• BACKGROUND
• IMPORTANCE OF MINIATURIZATION
• PACKAGING
• CONCEPT OF MICROMOLDING
• SURFACE MOUNTING
  • BACKGROUND
  • DESIGN AND MANUFACTURING PROCESS
  • WAVE SOLDERING MOVING TO VAPOR PHASE AND IR
  • ADVANTAGES VS THROUGH-HOLE
  • RESIN AND MATERIAL USAGE
  • COMPETITIVE RESIN SCENARIO
  • ON THE HORIZON
• TAPE AUTOMATED BONDING
  • BACKGROUND
  • ADVANTAGES
• CHIP-ON-BOARD
  • BACKGROUND
  • ADVANTAGES/DISADVANTAGES
  • SUBSTRATE MATERIALS
  • FLIP-CHIP BONDING
• THINWALLING ELECTRONIC COMPONENTS
  • BACKGROUND
  • THINWALLING IS NOT A NOVEL CONCEPT
  • EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
  • APPLICATION REQUIREMENTS
  • MATERIAL AND PROCESS SELECTION
  • PROPERTIES REQUIRED
  • Challenges in Downsizing
  • Software that Aids Thinwall Design

ELECTRONICS INDUSTRY

• TOP ELECTRONIC INDUSTRY MANUFACTURERS
• STRUCTURE OF ELECTRONIC COMPONENTS INDUSTRY
• ELECTRONIC INDUSTRY PRODUCTS
  • BACKGROUND
  • DESKTOP COMPUTERS
  • MOBILE DEVICES
  • Overview
  • Portable Computers/Laptops/Notebooks
  • Mobile Phones/Cellular Phones
  • Hand-Helds
  • Smart Phones
  • MARKET SLOWDOWN

MARKETING ASPECTS

• OUTSOURCING
• WHAT PLASTIC MOLDERS ARE DOING
• UPSTREAM MANUFACTURING
• CONTRACT MANUFACTURING

RESIN PRODUCERS

• OVERVIEW
• MAJOR PLAYERS IN THE RESIN ELECTRONIC COMPONENT MARKET
  • THERMOSETS
  • Epoxies
  • Polyesters
  • DAP
  • THERMOPLASTICS
  • Nylon 6
  • Nylon 66
  • Other Nylons
  • Polyesters
  • PPS
  • Polyimides
  • Polycarbonates
  • LCPs
  • Polysulfones
  • Fluoropolymers
  • Polyketones
• MOLDERS OF ELECTRONIC COMPONENTS

RECYCLING

• BACKGROUND
• ISSUES
• ELECTRONIC INDUSTRY INTERFACE

LIST OF TABLES

• SUMMARY TABLE A: CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, THROUGH 2006
• SUMMARY TABLE B: RESIN CONSUMPTION OF ELECTRONIC COMPONENTS BY END USE APPLICATION, 2001 AND 2006
• 1 COMPARISON OF NYLON 6 AND NYLON 66 BY PROPERTY
• 2 NYLON PRODUCERS AND CAPACITIES, 2001
• 3 NYLON MARKET BY APPLICATION, THROUGH 2006
• 4 GLOBAL PBT PRODUCERS AND CAPACITIES, 2001
• 5 PBT MARKET BY APPLICATION, THROUGH 2006
• 6 PET MARKET BY APPLICATION, THROUGH 2006
• 7 PCT MARKET BY APPLICATION, THROUGH 2006
• 8 PPS MARKET BY APPLICATION, THROUGH 2006
• 9 POLYIMIDE MARKET BY APPLICATION, THROUGH 2006
• 10 DOMESTIC POLYCARBONATE PRODUCERS AND CAPACITIES, 2001
• 11 POLYCARBONATE MARKET BY APPLICATION, THROUGH 2006
• 12 POLYPHTHALAMIDE MARKET BY APPLICATION, THROUGH 2006
• 13 LCP MARKET BY APPLICATION, THROUGH 2006
• 14 POLYSULFONE MARKET BY APPLICATION, THROUGH 2006
• 15 ALLOY/BLEND MARKET BY APPLICATION, THROUGH 2006
• 16 FLUOROPOLYMER MARKET BY APPLICATION, THROUGH 2006
• 17 POLYKETONE MARKETS BY APPLICATION, THROUGH 2006
• 18 SYNDIOTACTIC POLYSTYRENE MARKET BY APPLICATION, THROUGH 2006
• 19 TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, THROUGH 2006
• 20 REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
• 21 EPOXY MARKET BY APPLICATION, THROUGH 2006
• 22 POLYURETHANE MARKET BY APPLICATION, THROUGH 2006
• 23 PHENOLIC MARKET BY APPLICATION, THROUGH 2006
• 24 INGREDIENTS OF UNSATURATED POLYESTER RESIN FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL USE
• 25 UNSATURATED POLYESTER MARKET BY APPLICATION, THROUGH 2006
• 26 DAP MARKET BY APPLICATION, THROUGH 2006
• 27 TOTAL THERMOSET RESIN MARKET BY RESIN TYPE, THROUGH 2006
• 28 TOP NORTH AMERICAN PCB MANUFACTURERS, 2001
• 29 SELECTED KEY PCB LAMINATE SUPPLIERS
• 30 TOTAL PCB MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 31 PCB MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 32 PCB MARKET BY THERMOSET RESIN, THROUGH 2006
• 33 DEMAND FOR PASSIVE ELECTRONIC COMPONENTS, 2001
• 34 SELECTED MANUFACTURERS OF HIGH-DENSITY MULTIPIN CONNECTORS
• 35 TOTAL CONNECTOR MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 36 CONNECTOR MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 37 CONNECTOR MARKET BY THERMOSET RESIN, THROUGH 2006
• 38 TOTAL SWITCH MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 39 SWITCH MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 40 SWITCH MARKET BY THERMOSET RESIN, THROUGH 2006
• 41 TOTAL BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 42 BOBBIN MARKET BY THERMOPLASTIC BY RESIN, THROUGH 2006
• 43 BOBBIN MARKET BY THERMOSET RESIN, THROUGH 2006
• 44 TOTAL RELAY MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 45 RELAY MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 46 RELAY MARKET BY THERMOSET RESIN, THROUGH 2006
• 47 CAPACITOR MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 48 OTHER ELECTRONIC COMPONENT MARKET BY TYPE OF RESIN, THROUGH 2006
• 49 OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 50 OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET RESIN, THROUGH 2006
• 51 TOTAL MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2006
• 52 THERMOPLASTIC MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2006
• 53 THERMOSET MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2006
• 54 ENCAPSULANTS - APPLICATION MODE, ADVANTAGES AND DISADVANTAGES
• 55 SOME TYPICAL EPOXY ENCAPSULANT FORMULATIONS
• 56 SELECTED OTHER ENCAPSULANT SUPPLIERS
• 57 TOTAL ENCAPSULATION MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006
• 58 ENCAPSULANT MARKET BY THERMOSET RESIN, THROUGH 2006
• 59 ENCAPSULATION MARKET BY THERMOPLASTIC RESIN, THROUGH 2006
• 60 TOTAL RESIN MARKET BY APPLICATION, THROUGH 2006
• 61 THERMOPLASTIC RESIN MARKET BY APPLICATION, THROUGH 2006
• 62 THERMOSET MARKET BY APPLICATION, THROUGH 2006
• 63 PLASTICS CONSUMPTION IN ELECTRONIC COMPONENTS BY MAJOR END-USE INDUSTRY GROUPING, THROUGH 2006
• 64 PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN STATIONARY COMPUTERS AND PERIPHERALS, THROUGH 2006
• 65 PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN CONSUMER ELECTRONICS, THROUGH 2006
• 66 PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN PORTABLE COMPUTERS AND PERIPHERALS, THROUGH 2006
• 67 PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN OTHER MARKETS, THROUGH 2006
• 68 GENERAL RATINGS OF SHIELDING EFFECTIVENESS
• 69 TOP GLOBAL SEMICONDUCTOR COMPANIES, 2000
• 70 TOP NORTH AMERICAN PERSONAL COMPUTER COMPANIES, 1999 AND 2000
• 71 SELECTED LIST OF ACTIVE/PASSIVE AND PASSIVE ELECTRONIC COMPONENTS
• 72 TRADE NAMES OF RESINS USED IN ELECTRONIC COMPONENTS AND RELATED ELECTRICAL/ELECTRONIC PRODUCTS
• 73 TOP ELECTRIC/ELECTRONIC INJECTION MOLDERS

LIST OF FIGURES

• SUMMARY FIGURE A: CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, 2001 AND 2006
• SUMMARY FIGURE B: RESIN CONSUMPTION OF ELECTRONIC COMPONENTS BY END USE APPLICATION, 2001 AND 2006
• 1 TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, 2001 AND 2006
• 2 TOTAL THERMOSET RESIN MARKET BY RESIN TYPE, 2001 AND 2006
• 3 TOTAL PCB MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2001 AND 2006
• 4 TOTAL CONNECTOR MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2001 AND 2006
• 5 TOTAL SWITCH MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2002 AND 2006
• 6 TOTAL BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2001 AND 2006
• 7 TOTAL RELAY MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2001 AND 2006
• 8 OTHER ELECTRONIC COMPONENT MARKET BY TYPE OF RESIN, 2001 AND 2006
• 9 TOTAL MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, 2001 AND 2006
• 10 THERMOPLASTIC MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, 2001 AND 2006
• 11 THERMOSET MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, 2001 AND 2006
• 12 TOTAL ENCAPSULATION MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2006