BCC's new report is a look ahead for key materials and equipment used in the fabrication of semiconductors. Several of these wet, dry and advanced cleaning and planarization processes are at the locus of future semiconductor technology.

The report describes the expectations for this "timing is everything" industry and its currently $3 billion market as it delivers on demand for Ics with advanced features from 2001 to 2006.

Topics include the potential of the transition to 300mm wafers; the growing concern for runoff and wastewater management; and how the adoption of new processes, new materials and the latest technology road maps shapes the industry.

Table of contents:

TABLE OF CONTENTS

INTRODUCTION X

• REASONS FOR DOING THE STUDY X
• STUDY GOAL AND OBJECTIVES X
• CONTRIBUTION OF THE STUDY AND FOR WHOM X
• SCOPE AND FORMAT XI
• METHODOLOGY AND INFORMATION SOURCES XI
• BCC’S STATEMENT AND ANALYST’S CREDENTIALS XII
• RELATED BCC PUBLICATIONS XII
• BCC ON-LINE SERVICES XII

SUMMARY XIV

INDUSTRY OVERVIEW 1

• IMPORTANCE OF THE INDUSTRY AND WHERE IT FITS INTO THE ECONOMY 1
• DESCRIPTION OF THE INDUSTRY 2
• BACKGROUND TO THE CURRENT INDUSTRY 2
• GOVERNMENT/ENVIRONMENTAL REGULATION 3
• IMPORTANT INDICATIONS FOR THE INDUSTRY BEING STUDIED 5

THE TOTAL MARKET 7

TOTAL CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT 8

• MATERIALS AND EQUIPMENT FORECAST 10

THE CLEANING MARKET 13

• WET PROCESSES 15
• RCA CLEANS 16
• WET PROCESSES FORECAST 17
• Dilute Chemical Processing 18
• WET CHEMISTRY 19
• Wet Cleaning and Rinsing Chemistry Forecast 19
• Dilute Improves Margins 20
• Wet Stripping Chemistry Forecast 21
• Revenue Growth Inhibitors 21
• WET EQUIPMENT 22
• Wet Process Cleaning Equipment Forecast 23
• Water Concerns Aid Sales 23
• Bath and Bench Equipment Forecasts 24
• Dilute Chemisty's Influence 25
• Megasonic Enhancements 25
• Price of Average Unit Sold Rising 26
• Spray Wafer and Vapor Equipment Forecast 27
• Spray Cuts Out Immersion 28
• Vapor's Product Evolution 28
• Modules Accelerate Adoption 29
• DRY PROCESSES 29
• DRY PROCESSES FORECAST 31
• Advanced Upgrade 32
• Optimized Upgrade 33
• DRY CHEMISTRY 34
• Dry Process Photoresist Removal 34
• Dry Stripping Chemistry Forecast 36
• Evolving Product Mix 36
• Dry Process Residue Removal 37
• Dry Process Cleaning Chemicals and Gases Forecast 37
• Equipment-Based Influences 38
• DRY EQUIPMENT 38
• Plasma Generators 39
• Dry Process Cleaning Equipment Forecast 40
• As Good or Better Than Wet 40
• Integrated Wet and Dry 41
• Multi-Process Platform 42
• SOLVENT AND OTHER CLEANING METHODS 43
• SOLVENT AND OTHER CLEANING METHODS FORECAST 44
• Environmental Buy-In 44
• Enabling the Manufacture of Advanced Ics 45
• Integration 46
• SOLVENT CHEMISTRIES 46
• Inorganic and Organic Solvents 46
• Solvent Cleaning Chemistry Forecast 47
• Shortages 48
• High Purity Toll of Lower CDs 49
• OTHER EQUIPMENT-BASED CLEANING METHODS 50
• Cryogenic Cleaning Equipment Forecast 50
• Satisfies All Criteria 52
• Critical Fluids Forecast 52
• Other/Laser Equipment-Based Forecast 53

THE PLANARIZATION MARKET 55

• GRINDING AND LAPPING 55
• POLISHING 55
• PLANARIZATION 56
• CMP 56
• CMP SLURRY 57
• BULK WAFER CMP 57
• INTERLAYER CMP 58
• Oxide Polishing 58
• Metal Polishing 59
• PLANARIZATION FORECAST 59
• FINER CDS, THINNER LAYERS 60
• CMP MATERIALS 61
• CMP MATERIALS FORECASTS 63
• Aluminum to Copper 63
• Slurry Abrasives Forecasts 63
• Slurry Chemistry Forecasts 65
• PLANARIZATION EQUIPMENT 65
• PLANARIZATION EQUIPMENT FORECAST 67
• Cost of Ownership (CoO) 67
• CMP EQUIPMENT 68
• CMP Equipment Forecast 69
• POST-CMP EQUIPMENT 71
• Post-CMP Equipment Forecast 71
• Protecting Value 72
• Integration with CMP 72
• Wet Process Post-CMP Equipment Forecast 73
• Dry Process Post-CMP Equipment Forecast 74
• No Surface Tension 74
• Safer, More Effective Alternatives 75
• OTHER EQUIPMENT (PADS, PAD CONDITIONERS, FILTERS) FORECAST 76
• CMP Polishing Pads Forecast 77
• Tool Conditioners Forecast 77
• Filters Forecast 78

APPLICATIONS 80

• IC FABRICATION APPLICATIONS 80
• IC FABRICATION APPLICATION FORECASTS 80
• DRAM 83
• Microprocessors 84
• DSP 84
• Logic 85
• PLD, ASIC, and SOC 85
• Flash Memory/SRAM 85
• Analog/Mixed Signal 86
• Other Non-IC Applications 86
• UNIT TRENDS COMPARISON 87
• SEMICONDUCTOR WAFERS 89
• SILICON AND III-V COMPOUND SEMICONDUCTORS 89
• OTHER IMPORTANT MICROELECTRONICS APPLICATIONS 91
• SOI 91
• FLAT PANEL DISPLAY PLATES 92
• OTHER IMPORTANT ELECTRONICS APPLICATIONS 94
• HARD DISK OR THIN FILM HEAD FABRICATION 95
• MICROELECTRONIC APPLICATIONS END-MARKETS 96
• FORECASTS BY END-MARKET 98
• THE COMMUNICATIONS END-MARKET’S POTENTIAL 99
• COMPUTER END-MARKET’S POTENTIAL 100
• DEFENSE, COMMERCIAL R&D AND ACADEMIC/SCIENTIFIC RESEARCH END-MARKETSЃEPOTENTIAL 101

TECHNOLOGY 102

• INTRODUCTION 102
• METHODS OF MANUFACTURE AND ECONOMICS 103
• THE DEMANDS OF MICROLITHOGRAPHY IN IC FABRICATION 104
• PROCESS METHODS 107
• THE FUNCTION OF CLEANING AND PLANARIZATION 107
• Wafer Preparation Function 107
• Cleaning and Surface Preparation Function 108
• Surface Preparation 109
• Oxide Growth 109
• Photoresist Removal and Residue Removal Functions 110
• Different Kinds of Photoresists 110
• Polishing and Planarization 111
• Post CMP Cleans 111
• IMPORTANT NEW DEVELOPMENTS AND SIGNIFICANT CHANGES 112
• NEW MATERIALS 113
• Optical 114
• Optical Switching 115
• Alternatives to SiO2 116
• High-k 116
• PROCESS ECONOMICS 117
• SINGLE/MULTI-WAFER PROCESSING 118
• Single Wafer 118
• LARGER WAFERS 119
• GREEN PROCESSES 120
• DEFECT FREE 121

CLEANING AND PLANARIZATION AS A GLOBAL MARKET 122

• WHERE ICS ARE MANUFACTURED 124
• U.S. AND THE AMERICAS 126
• U.S. IN SLOWDOWN 127
• ECONOMIC VALUE 127
• JAPAN 127
• ACCEPTABLE PROGRESS 128
• ASIA PACIFIC 128
• TWICE AS DYNAMIC 129
• EUROPE 129
• MOVING FORWARD 130

INDUSTRY STRUCTURE AND COMPETITIVE ASPECTS 131

• INDUSTRY STRUCTURE 131
• CLEANING AND PLANARIZATION SOLUTION COMPANIES 131
• Chemical Suppliers 131
• Equipment Suppliers 132
• FORCES DRIVING THE INDUSTRY 133
• Market Cycles/Technology Advances 133
• Pricing/Industry Economics 133
• Over Capacity/Oversupply 134
• Backlog/Cancellations 134
• PURCHASING INFLUENCES 135
• THE TRADE OFF 135
• GOOD FIT WITH NEW BUSINESS MODEL 136
• Maximizing Investment with CoO 139
• SUCCESSFUL STRATEGIES IN THE CLEANING AND PLANARIZATION MARKET 141
• MAINTAINING LABORATORIES 141
• DEVELOPING JOINT RELATIONSHIPS WITH OTHER MANUFACTURERS 143
• OBTAINING REQUISITE TECHNOLOGY 144
• IDENTIFYING TRENDS AND KEEPING UP WITH TECHNOLOGY IN CLIENT INDUSTRY 145
• KNOWING CLIENTSЃEEXISTING EQUIPMENT AND PROCESSES 145
• COMPANY PROFILES OF LEADERS IN THE CLEANING AND PLANARIZATION MARKET 146
• APPLIED MATERIALS, INC. 146
• ASHLAND CHEMICAL 147
• ATMI, INC. 148
• AXCELIS TECHNOLOGIES 149
• CABOT MICROELECTRONICS CORPORATION 150
• DNS KOREA CO., LTD 151
• EBARA 151
• EKC TECHNOLOGY, INC. 153
• FSI INTERNATIONAL, INC 154
• FUJIMI CORPORATION 155
• LAM RESEARCH CORPORATION 156
• MATTSON TECHNOLOGY, INC 157
• NOVELLUS SYSTEMS INC 158
• PRAXAIR, INC 159
• ROHM AND HAAS 159
• SPEEDFAM-IPEC, INC 160

DIRECTORY OF COMPANIES 162

TERMS COMMONLY USED IN IC MANUFACTURING 171

LIST OF TABLES

• SUMMARY TABLE:WORLDWIDE MARKET FOR CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT, THROUGH 2006 XIV
• 1 TIMELINE OF IC INDUSTRY’S DEVELOPMENT OF DRAM, 2001-2008 6
• 2 TOTAL IC PROCESSING MATERIAL MARKET, 2000 9
• 3 TOTAL IC CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT MARKET, THROUGH 2006 11
• 4 WET AND DRY CLEANING MATERIALS AND EQUIPMENT MARKET, THROUGH 2006 13
• 5 TOTAL WET PROCESS MARKET, THROUGH 2006 18
• 6 WET PROCESS CHEMICALS MARKET, THROUGH 2006 21
• 7 WET CLEANING PROCESS EQUIPMENT MARKET, THROUGH 2006 24
• 8 DRY CLEANING PROCESSES MARKET, THROUGH 2006 31
• 9 DRY CLEANING PROCESS MATERIALS MARKET, THROUGH 2006 35
• 10 DRY PROCESS EQUIPMENT MARKET, THROUGH 2006 40
• 11 OTHER CLEANING METHODS AND EQUIPMENT MARKET, THROUGH 2006 44
• 12 SOLVENTS MARKET, THROUGH 2006 47
• 13 MARKET TRENDS FOR SOLVENT CLEANS CHEMISTRIES, 2000-2006 48
• 14 OTHER CLEANING EQUIPMENT MARKET, THROUGH 2006 50
• 15 PLANARIZATION MATERIALS AND EQUIPMENT MARKET, THROUGH 2006 59
• 16 CMP MATERIALS MARKET, THROUGH 2006 62
• 17 PLANARIZATION EQUIPMENT MARKET, THROUGH 2006 66
• 18 POST-CMP EQUIPMENT MARKET, THROUGH 2006 73
• 19 OTHER CMP EQUIPMENT MARKET, THROUGH 2006 77
• 20 IC APPLICATIONS OF CLEANING AND PLANARIZATION, 2001 AND 2006 81
• 21 CLEANING AND PLANARIZATION REVENUE TRENDS FOR ICS, THROUGH 2006 82
• 22 PERCENT OF IC APPLICATIONS BY TYPE, 2001 AND 2006 87
• 23 WAFER SUBSTRATES FORECAST, THROUGH 2003 91
• 24 FPD TECHNOLOGY TRENDS, 1997 AND 2010 94
• 25 CLEANING AND PLANARIZATION REVENUES BY IC END-MARKET, 2001 AND 2006 96
• 26 END-MARKETSЃEPERCENT SHARE OF ICS, 2001 AND 2006 97
• 27 CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT REVENUES BY GLOBAL REGION, THROUGH 2006 122
• 28 PERCENT SHARE OF CLEANING AND PLANARIZATION EQUIPMENT AND MATERIALS MARKET BY GLOBAL REGION, 2000 AND 2006 123
• 29 THE WORLD IC MARKET BY GLOBAL REGION, 2000 125
• 30 THE WORLD SEMICONDUCTOR EQUIPMENT MARKET BY GLOBAL REGION, 2000 125
• 31 PERCENT OF WORLD FOUNDRIES, BY LOCATION, 2000 126
• 32 PERCENT OF IC INDUSTRIESЃESEMICONDUCTORS AND WAFERS FABRICATED BY THIRD PARTY SILICON FOUNDRIES, BY YEAR, 2001-2006 136
• 33 WAFER DEMAND FROM FABLESS INDUSTRY, 2000-2002 137
• 34 TSMC’S UNIT VALUE OF ADVANCED IC PRODUCTION, 2001 138
• 35 PERCENT OF CAPITAL EXPENDITURES BUDGET CUTS IN THE IC INDUSTRY, 2000-2001 138
• 36 LEADING COMPANIES INVOLVED IN CLEANING AND PLANARIZATION, 2000 140

LIST OF FIGURES

• SUMMARY FIGURE:WORLDWIDE MARKET FOR CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT, 2000-2006 XIV
• 1 TOTAL IC PROCESSING MATERIAL MARKET, 2000 9
• 2 TOTAL IC CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT MARKET, 2000-2006 11
• 3 WET AND DRY CLEANING MATERIALS AND EQUIPMENT MARKET, 2000-2006 14
• 4 CMP MATERIALS MARKET, 2000-2006 62
• 5 IC APPLICATIONS OF CLEANING AND PLANARIZATION, 2001 AND 2006 82
• 6 CLEANING AND PLANARIZATION REVENUE TRENDS FOR ICS, 2001 AND 2006 83
• 7 PERCENT OF IC APPLICATIONS BY TYPE, 2001 AND 2006 87
• 8 CLEANING AND PLANARIZATION REVENUES BY IC END-MARKET, 2001 AND 2006 97
• 9 END-MARKETSЃEPERCENT SHARE OF ICS, 2001 AND 2006 98
• 10 CLEANING AND PLANARIZATION MATERIALS AND EQUIPMENT REVENUES BY GLOBAL REGION, 2001 AND 2006 123
• 11 PERCENT SHARE OF CLEANING AND PLANARIZATION EQUIPMENT AND MATERIALS MARKET BY GLOBAL REGION, 2000 AND 2006 124