Cleanrooms of varying class categories are used to solve different problems requiring different levels of air purity. There is not a simple correlation between cleanroom Class and feature size being processed. While it is obvious from cleanroom classifications that Class 1 will be required for sub 0.25 micron IC production, the use of minienvironments, particularly in 300mm fabs, can dictate the use of a higher Class cleanroom, as shown in Figure 1.1. With a 200mm fab, automation and SMIF are options. With a 300mm fab, automation is required and SMIF technology is incorporated with FOUPs, and every 300mm tool has a FOUP interface

The quality of chemicals and materials entering the fab area should be one of the most important concern of personnel in a semiconductor manufacturing facility. In order to undertake proper evaluation of chemicals and their suppliers, a total awareness program must be initiated in the facility. To achieve this goal, the primary requirement must be a commitment by management that personnel and monetary resources are dedicated to the purity issue regardless of cost.

This report addresses the issues of contamination of Si and GaAs wafers from liquid and gaseous chemicals, de-ionized water, and ambient air. The latest developments in the identification, monitoring, and removal of these contaminants are described, together with the trends in usage.

Chapter 1 Introduction

• 1.1 The Need For This Report

Chapter 2 Executive Summary

• 2.1 Summary of Major Findings
• 2.2 Summary of Market Forecast

Chapter 3 Cleanroom Design

• 3.1 Types of Cleanrooms
• 3.2 Minienvironments
  • 3.2.1 200mm
  • 3.2.2 300mm
• 3.3 Airflow Filtering
• 3.4 Electrostatic Discharge
• 3.5 Impact of ASIC Devices
• 3.6 Impact of VLSI Devices
• 3.7 Impact of Factory Automation and 300mm Wafers

Chapter 4 Worldwide Semiconductor Fabs

• 4.1 North American Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Plant Area
  • Cleanroom Area
• 4.2 European Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Plant Area
  • Cleanroom Area
• 4.3 Japanese Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
• 4.4 Korean Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
  • Total Sales
• 4.5 Taiwan Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area
• 4.6 ROW Fabs
  • Company
  • Address
  • Size of Wafer Processed
  • Minimum Feature Size
  • Process Technology
  • Principle Products
  • Employees
  • Cleanroom Area

Chapter 5 Contamination Issues

• 5.1 Liquid Chemicals
  • 5.1.1 Purification Methods
  • 5.1.2 Particulates
    • Effects on Yield
    • Particulate Removal
    • Particle Monitoring
  • 5.1.3 Bulk Distribution vs Bottles
  • 5.1.4 Piping System Construction
    • Materials of Construction
    • Cost Analysis
• 5.2 Gases
  • 5.2.1 Technology Issues
  • 5.2.2 Requirements
    • Purification Alternatives
    • Purity Trends
    • Particulate Considerations
• 5.3 Deionized Water
  • 5.3.1 Purification Specifications
  • 5.3.2 Purification Specification
  • 5.3.3 Purity Measurement Techniques
  • 5.3.4 Filtration And Ultrafiltration
  • 5.3.5 Piping System Construction
  • 5.3.6 DI Water System Costs
• 5.4 Processing Equipment
  • 5.4.1 Detection Methods
  • 5.4.2 Removal Techniques

Chapter 6 Market Forecast

• 6.1 Market Forecast Assumptions
• 6.2 Cleanroom Construction
  • 6.2.1 Cleanroom Design Criteria
  • 6.2.2 Class 1 Construction Costs
  • 6.2.3 Cleanroom Forecast
• 6.3 Wet Stations And Spray Processors
• 6.3 Forecasts of Liquid and Gas Filters
• 6.4 Gas Purification Systems Market

Chapter 7 Strategic User Issues

• 7.1 Cleanroom Personnel
• 7.2 User Requirements
  • 7.2.1 Benchmarking a Vendor
• 7.3 Need for Standardization

Chapter 8 Strategic Supplier Issues

• 8.1 Process Equipment Cleanliness
• 8.2 Supplier Strategies
• 8.3 Supplier Opportunities

LIST OF TABLES

• 3.1 Cleanroom HVAC Requirements
• 3.2 General Cleanroom Operating Cost Breakdown
• 3.3 Equipment Minienvironments
• 3.4 Comparison Table of DRAM Production Factors
• 5.1 Advantages and Disadvantages of Various Cleaning Metho
• 5.2 Chemical and Material Compatibility
• 5.3 Piping System Economic Analysis for Positive Developer
• 5.4 Gas Control System Issues
• 5.5 Range of Purity of CVD Gases
• 5.6 Potential Hazards of Processing Gases
• 5.7 Particle Sources
• 5.8 Location of In-Situ Monitors By Equipment Type
• 6.1 Worldwide Wafer Fab Projects -- U.S.
• 6.2 Worldwide Wafer Fab Projects -- Japan
• 6.3 Worldwide Wafer Fab Projects -- Europe
• 6.4 Worldwide Wafer Fab Projects -- Korea
• 6.5 Worldwide Wafer Fab Projects - Taiwan
• 6.6 Worldwide Wafer Fab Projects - Asia
• 6.7 Market Shares Of Automated Wet Station Suppliers
• 6.8 Market Shares Of Spray Processor Suppliers
• 6.9 Market For Large Gas Purification Systems
• 6.10 Market For POU Gas Purification Systems
• 6.11 Market For Catalytic Absorption Purification Systems
• 6.12 Market For Catalytic Absorption Purification Systems
• 6.13 Market For Palladium Purification Systems
• 6.14 Market For Palladium Purification Systems
• 6.15 Market For Getter Purification Systems
• 6.16 Market For Getter Purification Systems
• 6.17 Market For Resin Purification Systems
• 6.18 Market For Resin Purification Systems

LIST OF FIGURES

• 1.1 Cleanroom Class Vs Feature Size
• 3.1 Fab Cost Versus Year
• 3.2 Contamination Levels With and Without SMIF Box
• 3.3 FOUP in Cluster Tool
• 3.4 Contamination Levels During Cleanroom Work Cycles
• 5.1 Relationship Between Device Yield and Particles
• 5.2 Relationship Between Die Yield and Chip Size
• 5.3 Sources of Particles
• 6.1 Cleanroom Class Vs Feature Size
• 6.2 Cost of a Semiconductor Facility
• 6.3 Equipment and Facility Cost Ratio
• 6.4 Fab Operational Cost Structure Versus Feature Size
• 7.1 Example of a QC Flow Chart