Semiconductor chips face constant pressure for increased performances while still decreasing their size. At the same time their packages must be able to accommodate new functionalities. The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs.
Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, ""through-Si vias"") seems to be unavoidable in the future for miniaturization first and increased performances after.
3D integration will use technologies originally developed for MEMS technology but for different markets. In our report, we have analyzed that portable applications are a strong market driver for 3D integration.
Stacking memories, stacking memories and logic, image sensors with µP and FPGAs will be the first mass market applications. In 2010, we forecast that 1 billion of Flash memories will be stacked with TSVs (see figure 1).
3D is the most ""integrated"" approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices. There are however strong challenges. They are: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes. In our report we have analyzed and compared the different technical solutions and figure 2 shows an example of process cost comparison for TSVs realization.
We are at the crossroads of numerous breakthroughs in 3D stacking! Although 3D ICs are at the R&D stage in the largest semiconductor companies today, the recent announcement of Samsung in 2006 could speed up micro-via technology especially for the memory business. By acquiring the new Yole 3D IC report, you will have access to:
This report targets both devices manufacturers and packaging companies as 3D will be such a breakthrough for packaging than developments are running whatever the activity of the semiconductor companies. This report is of great interest for equipments manufacturers as well, as new investments are planned in a close future for implementing all the 3D technological steps.So, whatever is your responsibility, R&D, production, marketing or business development, the Yole 3D IC report will give you a deep insight for markets and technological challenges for 3D integration.